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Heat Sink Design

Heat Sink Design   In last month’s Blog we discussed alternative techniques for increasing the amount of heat dissipation in electronic circuits and components. One of the most commonly used approaches to increase heat dissipation is the use of heat sinks. Heat sink design seeks to maximize the surface area in contact with the surrounding […]

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Improved Thermal Analysis for Electronics Cooling

So far we have explored preliminary ways to predict the temperatures in a circuit using simple thermal resistance network calculations. This post addresses improved thermal analysis for electronics cooling. Consistent exposure to high operating temperatures can lead to degradation of material properties and development of thermal stresses that can ultimately lead to device failure. The

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Ohio Supercomputer Brings Better, Stronger, Faster… Simulations!

154,000,000,000,000 Reasons   Back in July, we posted a Blog announcing Third Frontier Commission Invests in Ohio Businesses. Just recently, Douglas J. Guth in HiVelocity Magazine highlighted 154 Trillion reasons why. His article is a must read, especially for those Ohio businesses who have felt like they were part of the “missing middle.”    

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