Electronic Cooling

Saving Time and Money for Rockwell Automation

Problem: As Rockwell Automation looked to improve product functionality, engineers relied on developing physical prototypes to test heat sink designs for its powerful microprocessor chips. This approach left mechanical engineers scrambling at the end of the design cycle to find an electronics cooling solution that would fit the prototypes and not delay new product releases. …

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Thermal mitigation for high power electronics

HeatSinkSim

HeatSinkSim Changing Electronics Cooling   It has been a while since we have put out a Blog on electronics cooling and there is a very good reason for that – not much has changed, until now.   Progressive companies manufacturing electronic components and circuits consistently challenge the limits of component performance by offering increased functionality …

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Heat Sink Design

Heat Sink Design   In last month’s Blog we discussed alternative techniques for increasing the amount of heat dissipation in electronic circuits and components. One of the most commonly used approaches to increase heat dissipation is the use of heat sinks. Heat sink design seeks to maximize the surface area in contact with the surrounding …

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Improved Thermal Analysis for Electronics Cooling

So far we have explored preliminary ways to predict the temperatures in a circuit using simple thermal resistance network calculations. This post addresses improved thermal analysis for electronics cooling. Consistent exposure to high operating temperatures can lead to degradation of material properties and development of thermal stresses that can ultimately lead to device failure. The …

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Thermal Resistance Networks for Electronics Cooling Solutions: Initial Set Up

During a feasibility analysis for electronics cooling solutions, the objective is to estimate the heat flow using engineering approaches and judgment. By applying a thermal resistance network to the heat flow pathways within the system quantitative estimates for heat flow can be developed as an initial screen for feasibility of component design. As an example …

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Beginning evaluation of a system-level thermal solution-Part 1

Many industries face increased thermal challenges with their electronic products.  Customers often want devices with smaller form factors and higher functionality, but these changes create higher thermal fluxes and power density, which in turn require better thermal management to prevent device failure.   From the electrical designer’s standpoint, getting traction on thermal problems may be …

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Thermal Management methods of electronics

Thermal Management: A growing concern The demand for compact, multi-functional, high performance electronics has led to a dramatic increase in the power density of devices. In particular, the thermal dissipation per area of chip and per volume of system enclosure has increased dramatically in the last decade.  To make matters worse, system-level requirements for small …

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