Create The Future Design Contest Winners Congratulations to all the winners from this year’s Create the Future Design Contest. COMSOL and Tech Briefs Media Group again sponsored, along with SAE International. This was the 11th year the competition has been held. 925 entries from 56 countries made judging this year’s competition very difficult. […]
Create The Future Design Contest Winners – 2013 Read More »
154,000,000,000,000 Reasons Back in July, we posted a Blog announcing Third Frontier Commission Invests in Ohio Businesses. Just recently, Douglas J. Guth in HiVelocity Magazine highlighted 154 Trillion reasons why. His article is a must read, especially for those Ohio businesses who have felt like they were part of the “missing middle.”
Ohio Supercomputer Brings Better, Stronger, Faster… Simulations! Read More »
During our recent webinar with COMSOL on thermal-structure interaction modeling, we at AltaSim Technologies demonstrated modeling of a MEMS energy harvester that scavenges waste heat. Examples of sources for waste heat range from microprocessor chips, to internal combustion engines, to chemical processing plants. If the waste heat generated from these cases could be used to
MEMS Energy Harvester for Reusing Waste Heat Read More »
Previously we have discussed ways to complete a feasibility thermal management analysis. For a given thermal budget, we want to determine whether the junction temperature will meet specifications for reliability and thermal runaway. In electronic systems that rely on air flow for cooling, convection is of paramount importance. Power dissipation due to convection
Estimating heat transfer coefficients Read More »
Decrease Total RAM Required to Solve Sequentially Coupled Multiphysics problems. Another COMSOL Tips & Tricks Deposit: Are you solving a multiphysics problem? If so, do you know if your equations are sequentially coupled or intimately coupled? Well, if your equations are sequentially coupled, you can decrease the total RAM required to solve your systems
COMSOL Tips & Tricks Read More »
FEA (Finite Element Analysis) – Critical Questions to Ask Jack Thornton, MINDFEED Marcomm, wrote an excellent article on FEA that we really thought would be good to share – “Questions Decision Makers Should Ask About Computer Simulations”. Thornton starts out his article with the following two paragraphs: “The computerization of engineering (and everything
FEA (Finite Element Analysis) – Critical Questions to Ask Read More »
In an earlier blog the thermal resistance network shown in Figure 1 was developed. Figure 1: The heat dissipation paths from the die are: to the case of the package, and through the BGA into the PCB. Heat is then dissipated through the skin of the device by convection to the environment. The two dissipation
Thermal Resistance Networks: Application Read More »
During a feasibility analysis for electronics cooling solutions, the objective is to estimate the heat flow using engineering approaches and judgment. By applying a thermal resistance network to the heat flow pathways within the system quantitative estimates for heat flow can be developed as an initial screen for feasibility of component design. As an example
Thermal Resistance Networks for Electronics Cooling Solutions: Initial Set Up Read More »
Third Frontier Commission Invests in Ohio Businesses Imagine attaching a “booster” to your business, and then imagine the possibilities for growth and expansion. Well, that’s just what the Ohio Third Frontier Commission recently did for Ohio businesses. We believe the following statement pulled from the linked article really says it all: “Many large manufacturers
Third Frontier Commission Boosts Ohio Businesses Read More »
We have just completed another successful COMSOL training class, Solving COMSOL Multiphysics Problems. How do we know it was a success? Because our attendees told us without us asking. Each of the students took time to share with us their thoughts on the quality of the course material and instruction. We are grateful for their
Another successful COMSOL Training class! Read More »