AltaSim has much to be Thankful for. As we approach Thanksgiving, all of us at AltaSim decided to share one or two technologies we are thankful for. Here’s our list: Jeff – I am thankful for the Turkey Deep Fryer… and for Fire Extinguishers! (And I’m glad I don’t have to eat Pumpkin […]
An AltaSim Thanksgiving Read More »
Can SpaceClaim Provide Frustration Management? In all our years of doing analysis, we have discovered that waiting can be frustrating. Broken CAD. Dirty Geometry. Simulation Delays. Mounting Frustration. We have experienced all four. And this causes a significant breakdown in the entire development cycle. And when we consider all of the other people we
SpaceClaim Equals Frustration Management Read More »
So far we have explored preliminary ways to predict the temperatures in a circuit using simple thermal resistance network calculations. This post addresses improved thermal analysis for electronics cooling. Consistent exposure to high operating temperatures can lead to degradation of material properties and development of thermal stresses that can ultimately lead to device failure. The
Improved Thermal Analysis for Electronics Cooling Read More »
Create The Future Design Contest Winners Congratulations to all the winners from this year’s Create the Future Design Contest. COMSOL and Tech Briefs Media Group again sponsored, along with SAE International. This was the 11th year the competition has been held. 925 entries from 56 countries made judging this year’s competition very difficult.
Create The Future Design Contest Winners – 2013 Read More »
154,000,000,000,000 Reasons Back in July, we posted a Blog announcing Third Frontier Commission Invests in Ohio Businesses. Just recently, Douglas J. Guth in HiVelocity Magazine highlighted 154 Trillion reasons why. His article is a must read, especially for those Ohio businesses who have felt like they were part of the “missing middle.”
Ohio Supercomputer Brings Better, Stronger, Faster… Simulations! Read More »
During our recent webinar with COMSOL on thermal-structure interaction modeling, we at AltaSim Technologies demonstrated modeling of a MEMS energy harvester that scavenges waste heat. Examples of sources for waste heat range from microprocessor chips, to internal combustion engines, to chemical processing plants. If the waste heat generated from these cases could be used to
MEMS Energy Harvester for Reusing Waste Heat Read More »
Previously we have discussed ways to complete a feasibility thermal management analysis. For a given thermal budget, we want to determine whether the junction temperature will meet specifications for reliability and thermal runaway. In electronic systems that rely on air flow for cooling, convection is of paramount importance. Power dissipation due to convection
Estimating heat transfer coefficients Read More »
Decrease Total RAM Required to Solve Sequentially Coupled Multiphysics problems. Another COMSOL Tips & Tricks Deposit: Are you solving a multiphysics problem? If so, do you know if your equations are sequentially coupled or intimately coupled? Well, if your equations are sequentially coupled, you can decrease the total RAM required to solve your systems
COMSOL Tips & Tricks Read More »
FEA (Finite Element Analysis) – Critical Questions to Ask Jack Thornton, MINDFEED Marcomm, wrote an excellent article on FEA that we really thought would be good to share – “Questions Decision Makers Should Ask About Computer Simulations”. Thornton starts out his article with the following two paragraphs: “The computerization of engineering (and everything
FEA (Finite Element Analysis) – Critical Questions to Ask Read More »
In an earlier blog the thermal resistance network shown in Figure 1 was developed. Figure 1: The heat dissipation paths from the die are: to the case of the package, and through the BGA into the PCB. Heat is then dissipated through the skin of the device by convection to the environment. The two dissipation
Thermal Resistance Networks: Application Read More »