Continuity Pairs for Electrical and Thermal Contact

Thermal stresses are an important design concern for many engineering applications.  When temperatures change, materials can deform or warp leading to the build-up of internal stresses even without the presence of external constraints which can further increase thermal stresses.  Modeling and simulation can calculate the deformations, stresses and changing contact pressures using thermal-structural interaction techniques.  […]

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It’s a Small World – Designing Piezoelectric Acoustic Transducers as Devices Miniaturize, Part 1

The increasing miniaturization and sophistication of electronic products–ranging from consumer media devices, to medical diagnostic tools, to defense-related sonar applications–presents a bounty of utility and ease for consumers, and an ongoing challenge for design engineers. These seemingly disparate products (audio/mobile device speakers, certain non-invasive medical devices and sonar arrays) share in common a reliance on

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It’s a Small World – Designing Piezoelectric Acoustic Transducers as Devices Miniaturize, Part 2

In Part 1, we provided a basic introduction to Piezoelectric materials. In this blog, we will take a look at specific products that present a challenge for design engineers due to the need for increased output within smaller devices. Mics and Speakers Piezoelectric materials are used extensively in acoustics. Microphones contain piezoelectric crystals that convert

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Using Evaluation Operator in Post-Processing

Engineers post process their simulation results for reasons that range from better understanding their results to communicating those results to others.  Developing labels that clearly identify the conditions for a simulation communicates the critical input parameters for the plotted results. In this Tip and Trick, the simulation engineers at AltaSim will show a way to

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Cracks in the System – Thermomechanical Fatigue of Electronics Components, Part 2

As discussed in Part 1, engineers are tasked with designing electrical components that can withstand the increased thermal and mechanical loads required of today’s ever-more-powerful electronics. Sometimes these are entirely new designs built from the ground up, and subjected to holistic testing and prototyping during the R&D phase. But often, manufacturers seek to merely tweak

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Cracks in the System – Thermomechanical Fatigue of Electronics Components, Part 1

The airbags in your car; the camera on your video doorbell; the phone or other electronic device you’re reading this on right now. The everyday products that make modern life possible wouldn’t be able to run without key electrical components that maintain functionality and stability for years at a time. And yet, these electrical components

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Electromagnetic Wave Polarization in 2D Geometry

An electromagnetic wave consists of a coupled oscillating electric field and magnetic field which are always perpendicular to each other. By convention, the “polarization” of electromagnetic waves refers to the direction of the electric field. In 3D geometry, arbitrary polarization is naturally defined by the prescribing the directions of all three components of the electric

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Use of Computational Simulation of Medical Technology – Part 7

Multiphysics Modeling of Cooled RF Ablation In previous blog posts, we have provided extensive discussion on the Use of Computational Simulation of Medical Technology[1].  To provide a specific demonstration, this blog post will focus on describing the implementation of a multiphysics simulation of a cooled RF ablation (C-RFA) device. Traditional vs Cooled RF technology Traditional

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