Joshua Thomas

Continuity Pairs for Electrical and Thermal Contact

Thermal stresses are an important design concern for many engineering applications.  When temperatures change, materials can deform or warp leading to the build-up of internal stresses even without the presence of external constraints which can further increase thermal stresses.  Modeling and simulation can calculate the deformations, stresses and changing contact pressures using thermal-structural interaction techniques. 

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Use of Computational Simulation of Medical Technology – Part 7

Multiphysics Modeling of Cooled RF Ablation In previous blog posts, we have provided extensive discussion on the Use of Computational Simulation of Medical Technology[1].  To provide a specific demonstration, this blog post will focus on describing the implementation of a multiphysics simulation of a cooled RF ablation (C-RFA) device. Traditional vs Cooled RF technology Traditional

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Temperature-Dependent Coefficients of Thermal Expansion

In short: a secant CTE is the average expansion from a reference temperature (usually 273 K) to the current temperature, and a tangent CTE is the rate of expansion at that temperature. COMSOL Multiphysics® accepts either through its “Input type” setting and converts between them on its own. You only need to adjust your data

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Solver Improvement in COMSOL Multiphysics Version 5.6

At AltaSim, we await COMSOL’s improvements to their software with great anticipation.  We take time to evaluate these changes to determine what we can use to better serve our clients.  Based on our review, we also pass on our insights via Tips & Tricks. Version 5.6 of COMSOL Multiphysics has introduced serval solver improvements that

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