Jeffrey Crompton

shutterstock 129916439

Heat Sink Design

Heat Sink Design   In last month’s Blog we discussed alternative techniques for increasing the amount of heat dissipation in electronic circuits and components. One of the most commonly used approaches to increase heat dissipation is the use of heat sinks. Heat sink design seeks to maximize the surface area in contact with the surrounding …

Heat Sink Design Read More »

shutterstock 129916439

Improved Thermal Analysis for Electronics Cooling

So far we have explored preliminary ways to predict the temperatures in a circuit using simple thermal resistance network calculations. This post addresses improved thermal analysis for electronics cooling. Consistent exposure to high operating temperatures can lead to degradation of material properties and development of thermal stresses that can ultimately lead to device failure. The …

Improved Thermal Analysis for Electronics Cooling Read More »

shutterstock 129916439

Estimating heat transfer coefficients

Previously we have discussed ways to complete a feasibility thermal management analysis. For a given thermal budget, we want to determine whether the junction temperature will meet specifications for reliability and thermal runaway.   In electronic systems that rely on air flow for cooling, convection is of paramount importance.   Power dissipation due to convection …

Estimating heat transfer coefficients Read More »

shutterstock 129916439

Thermal Resistance Networks for Electronics Cooling Solutions: Initial Set Up

During a feasibility analysis for electronics cooling solutions, the objective is to estimate the heat flow using engineering approaches and judgment. By applying a thermal resistance network to the heat flow pathways within the system quantitative estimates for heat flow can be developed as an initial screen for feasibility of component design. As an example …

Thermal Resistance Networks for Electronics Cooling Solutions: Initial Set Up Read More »

Comsol inline fins

Beginning evaluation of a system-level thermal solution-Part 1

Many industries face increased thermal challenges with their electronic products.  Customers often want devices with smaller form factors and higher functionality, but these changes create higher thermal fluxes and power density, which in turn require better thermal management to prevent device failure.   From the electrical designer’s standpoint, getting traction on thermal problems may be …

Beginning evaluation of a system-level thermal solution-Part 1 Read More »

electronics cooling small

Thermal Management methods of electronics

Thermal Management: A growing concern The demand for compact, multi-functional, high performance electronics has led to a dramatic increase in the power density of devices. In particular, the thermal dissipation per area of chip and per volume of system enclosure has increased dramatically in the last decade.  To make matters worse, system-level requirements for small …

Thermal Management methods of electronics Read More »