Ceramic Matrix Composites – Solidifying it all In the preceding Blogs on Ceramic Matrix Composites we have provided an outline of an intimately coupled multiphysics problem and how the controlling factors can be formulated to develop a predictive physics-based computational model. But what we really need to do if we are to help this […]
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Residual Stress and Distortion – Ceramic Matrix Composites Now that we have the analysis formulated to address the issues associated with fluid flow, reaction and thermal history the approach can be extended to predict the development of residual stresses and resulting component distortion in the final component. The residual stress generated during processing was
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Thermal-Ceramic Matrix Composites In addition to fluid flow and chemical reaction, the thermal response during infiltration of liquid is important to include in any analysis of the RMI process. For CMCs of interest for aerospace use the liquid is molten Silicon with a melting temperature of approximately 1687K, and during infiltration this thermal energy
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Reaction-Ceramic Matrix Composites In the last Blog we looked at analyzing fluid flow into a porous medium, in the manufacture of CMCs using the RMI process simultaneously with the fluid infiltration a reaction takes place between the infiltrating molten liquid and the porous preform. Thus the second step in developing a computational analysis of
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Fluid Flow in Ceramic Matrix Composites In a previous Blog we discussed some of the background to the production of Ceramic Matrix Composites (CMCs) using the Reactive Melt Infiltration (RMI) process. In this Blog we will address some of the issues associated with the first step in the process: infiltration of molten material into a
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Ceramic Matrix Composites: Background We are often asked “What do you mean by fully coupled multiphysics simulations?” By way of answering this question we are providing a series of Blog articles that will explain the background to a fully coupled multiphysics simulation using a direct example on simulating the processing of ceramic matrix composites (CMC),
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Heat Sink Design In last month’s Blog we discussed alternative techniques for increasing the amount of heat dissipation in electronic circuits and components. One of the most commonly used approaches to increase heat dissipation is the use of heat sinks. Heat sink design seeks to maximize the surface area in contact with the surrounding
Thermal Mitigation – Common Approaches If the operating temperatures remain outside the prescribed thermal budget established for safe device and component operation we are now faced with two options: either reduce the power levels that may change device functionality or increase the dissipation of heat to reduce the standard operating temperatures. In some
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So far we have explored preliminary ways to predict the temperatures in a circuit using simple thermal resistance network calculations. This post addresses improved thermal analysis for electronics cooling. Consistent exposure to high operating temperatures can lead to degradation of material properties and development of thermal stresses that can ultimately lead to device failure. The
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Previously we have discussed ways to complete a feasibility thermal management analysis. For a given thermal budget, we want to determine whether the junction temperature will meet specifications for reliability and thermal runaway. In electronic systems that rely on air flow for cooling, convection is of paramount importance. Power dissipation due to convection
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