Jeffrey Crompton

In an earlier blog the thermal resistance network shown in Figure 1 was developed. Figure 1: The heat dissipation paths from the die are: to the case of the package, and through the BGA into the PCB.  Heat is then dissipated through the skin of the device by convection to the environment. The two dissipation

During a feasibility analysis for electronics cooling solutions, the objective is to estimate the heat flow using engineering approaches and judgment. By applying a thermal resistance network to the heat flow pathways within the system quantitative estimates for heat flow can be developed as an initial screen for feasibility of component design. As an example

Many industries face increased thermal challenges with their electronic products.  Customers often want devices with smaller form factors and higher functionality, but these changes create higher thermal fluxes and power density, which in turn require better thermal management to prevent device failure.   From the electrical designer’s standpoint, getting traction on thermal problems may be

Thermal Management: A growing concern The demand for compact, multi-functional, high performance electronics has led to a dramatic increase in the power density of devices. In particular, the thermal dissipation per area of chip and per volume of system enclosure has increased dramatically in the last decade.  To make matters worse, system-level requirements for small