Previously we have discussed ways to complete a feasibility thermal management analysis. For a given thermal budget, we want to determine whether the junction temperature will meet specifications for reliability and thermal runaway.   In electronic systems that rely on air flow for cooling, convection is of paramount importance.   Power dissipation due to convection […]

In an earlier blog the thermal resistance network shown in Figure 1 was developed. Figure 1: The heat dissipation paths from the die are: to the case of the package, and through the BGA into the PCB.  Heat is then dissipated through the skin of the device by convection to the environment. The two dissipation

During a feasibility analysis for electronics cooling solutions, the objective is to estimate the heat flow using engineering approaches and judgment. By applying a thermal resistance network to the heat flow pathways within the system quantitative estimates for heat flow can be developed as an initial screen for feasibility of component design. As an example

Many industries face increased thermal challenges with their electronic products.  Customers often want devices with smaller form factors and higher functionality, but these changes create higher thermal fluxes and power density, which in turn require better thermal management to prevent device failure.   From the electrical designer’s standpoint, getting traction on thermal problems may be