Cracks in the System – Thermomechanical Fatigue of Electronics Components, Part 2
As discussed in Part 1, engineers are tasked with designing electrical components that can withstand the increased thermal and mechanical loads required of today’s ever-more-powerful electronics. Sometimes these are entirely new designs built from the ground up, and subjected to holistic testing and prototyping during the R&D phase. But often, manufacturers seek to merely tweak […]
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