154,000,000,000,000 Reasons Back in July, we posted a Blog announcing Third Frontier Commission Invests in Ohio Businesses. Just recently, Douglas J. Guth in HiVelocity Magazine highlighted 154 Trillion reasons why. His article is a must read, especially for those Ohio businesses who have felt like they were part of the “missing middle.” […]
Ohio Supercomputer Brings Better, Stronger, Faster… Simulations! Read More »
During our recent webinar with COMSOL on thermal-structure interaction modeling, we at AltaSim Technologies demonstrated modeling of a MEMS energy harvester that scavenges waste heat. Examples of sources for waste heat range from microprocessor chips, to internal combustion engines, to chemical processing plants. If the waste heat generated from these cases could be used to
MEMS Energy Harvester for Reusing Waste Heat Read More »
Previously we have discussed ways to complete a feasibility thermal management analysis. For a given thermal budget, we want to determine whether the junction temperature will meet specifications for reliability and thermal runaway. In electronic systems that rely on air flow for cooling, convection is of paramount importance. Power dissipation due to convection
Estimating heat transfer coefficients Read More »
Decrease Total RAM Required to Solve Sequentially Coupled Multiphysics problems. Another COMSOL Tips & Tricks Deposit: Are you solving a multiphysics problem? If so, do you know if your equations are sequentially coupled or intimately coupled? Well, if your equations are sequentially coupled, you can decrease the total RAM required to solve your systems
COMSOL Tips & Tricks Read More »