Wafer Manufacturing

AltaSim guides engineers through multiphysics simulations so they can bring their products to market more rapidly, at a lower cost and with an optimized design.  To help better understand what that looks like, we have put together a brief case study of how our simulation gurus provided a practical solution in a recent project.


One of AltaSim’s clients supplies process control equipment for the manufacturing of electronics components that are used in everyday products like personal computers, cell phone and hybrid cars.  They were working with one of their customers to develop a new manufacturing process for electronics packaging. The process included heating the packaging to a high temperature. Due to the different materials of construction and the complex geometry, our client was concerned about fracturing the package during manufacturing. They faced an expensive and time-consuming product development cycle due to prototyping of their machine designs.


Our client leveraged AltaSim’s extensive expertise in developing multiphysics simulations of the heating and deformation of electronics packages. AltaSim developed simulations to represent all six stages of the manufacturing process. These simulations showed that the manufacturing process would produce a high fracture rate for the products. Our engineers modified the product design to reduce the likelihood of fracture during manufacturing.


AltaSim identified critical design changes to enable the electronics packaging to sustain elevated temperatures during manufacturing without fracturing. Our client saved six to twelve months of process development time and several million dollars in development costs.

To learn more about thermal simulations, please click here.

In addition to developing simulations for our clients, AltaSim also trains engineers to develop simulations. In order to maximize the attention each student receives, we limit our courses to eight students. Click here for more information on our classes.


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March 2022 Case Study