Demand for electronic devices with smaller sizes and improved processor and graphics functionality has resulted in higher power densities and thus significant increases in the heat generated at the component, board and system level. The higher operating temperatures can cause a significant reduction in the operating lifetime of electronic devices and thus managing the evolution, distribution and dissipation of thermal energy in electronic components and circuits is important for long term reliability.
Controlled dissipation of thermal energy may require the use of multiple approaches to obtain an effective solution. AltaSim has experience solving these complex electronics cooling problems in natural and forced convection environments. A range of factors should be considered in the development of any solution, including:
- Component level thermal properties such as ΘJ-B and ΘJ-c
- Board design and component layout to optimize flow and enhance conduction
- Thermal dissipation to the surrounding environment
By applying this integrated approach our engineers have developed solutions for dissipation of thermal energy at the package, board, system and rack levels. By combining our experience with computational analysis and quantifying measurement uncertainty and stability we have refined our approaches to provide a level of accuracy and fidelity required for specific applications allowing us to meet product requirements and provide thermal margin. Our proprietary S3 methodology allows us to solve cutting edge challenges rapidly and help ensure our customers are equipped with viable solutions without the delays associated with conventional prototype construction, testing, or re-tooling.
At AltaSim, we realize that customer needs vary depending on time in the product design cycle, availability of validated thermal models and selection of technology to meet cost, manufacturability and thermal design targets. Integration of strategically designed computational simulations allows us to quantify the effects of specific design changes and the interrelationship between multiple variables thus providing a broad, yet metered view of the product design.
Whether your present focus is local heat removal from a high-powered component, determining the ideal placement of IC packages in a system, identifying the flow rates needed for cooling, optimizing heat sink design, or managing dynamic power dissipation using a combination of multi-core processing, feedback controls, phase change materials, etc., AltaSim can support your team in the development of robust solutions for thermal management of electronic components and systems.
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