May 2013

Wavelengths

Mesh Refinement for Wave Problems

Wave propagation problems require sufficient mesh refinement to ensure twelve degrees of freedom per wavelength. This requirement develops from the error associated with approximating a sine wave with a polynomial. AltaSim Technologies shares this type of information regularly with users of the COMSOL Multiphysics software through our Tips and Tricks.  If you are interested in […]

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Wavelengths

COMSOL Tips and Tricks – Resolving Wavelengths in Vibrational Problems

As part of our efforts to assist COMSOL users in performing high-quality analysis, we recently used our bi-monthly email to provide a COMSOL Tips and Tricks update. In this tip, we remind users to include twelve degrees of freedom per wavelength when meshing wave problems. The following video demonstrates why twelve degrees of freedom per

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Quenching

Conjugate Heat Transfer: Quenching Analysis in COMSOL Multiphysics

This presentation provides an overview of quenching analyses as a specific example of conjugate heat transfer analysis. The presentation was given as part of a webinar on heat transfer analysis using COMSOL Multiphysics. Work conducted on analyzing air and oil quenching appears in this presentation. These quenching analyses include heat transfer mechanisms of conduction, convection,

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Quenching

Heat Transfer Demo Using COMSOL Multiphysics

Heat Transfer … … using COMSOL Multiphysics to simulate quenching of hot metal into an oil bath. This video shows how to set up partial differential equations as boundary conditions to describe the film boiling process. PDE boundary conditions within COMSOL Multiphysics provide significant flexibility for the user to develop complex models without writing separate

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electronics cooling small

Thermal Management methods of electronics

Thermal Management: A growing concern The demand for compact, multi-functional, high performance electronics has led to a dramatic increase in the power density of devices. In particular, the thermal dissipation per area of chip and per volume of system enclosure has increased dramatically in the last decade.  To make matters worse, system-level requirements for small

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