As electronic devices offer increased functionality in smaller form factors the associated higher power densities can give rise to significant heat generation that affects long term device operation and functionality. To help design individual components, board layouts and integrated systems that can effectively dissipate thermal energy, AltaSim combines its expertise in thermal analysis and computational fluid dynamics with practical experience in applying ANSYS IcePak software.
Our knowledge of the most effective approach for developing the required level of detail for the application allows us to predict the effects of fluid flow and heat transfer at the component, board or system level, consequently AltaSim can provide:
- Improved design
- Optimized performance
- Reduced need for physical prototypes and testing
- Shortened time-to-market
Our expertise in this area has supported applications for products in manufacturing and processing industries, aerospace navigation and control systems, and consumer electronics products. Among the examples of applications that have been investigated are:
- Heat sink optimization for passive cooling of power electronic circuits
- Heat pipe design using fan assisted cooling
- Component layout and PCB thermal via connectivity
- Board assembly and lay up
- Rack mounted system design
If you are interested in speaking with us about developing solutions for electronics cooling challenges, then please complete our contact us form, or call.
Struggling with IcePak?
Contact Us about our IcePak consulting services!