Recent Articles
154,000,000,000,000 Reasons Back in July, we posted a Blog announcing Third Frontier Commission Invests in Ohio Businesses. Just recently, […]
During our recent webinar with COMSOL on thermal-structure interaction modeling, we at AltaSim Technologies demonstrated modeling of a MEMS energy […]
Previously we have discussed ways to complete a feasibility thermal management analysis. For a given thermal budget, we want to […]
Decrease Total RAM Required to Solve Sequentially Coupled Multiphysics problems. Another COMSOL Tips & Tricks Deposit: Are you solving […]
FEA (Finite Element Analysis) – Critical Questions to Ask Jack Thornton, MINDFEED Marcomm, wrote an excellent article on FEA that […]
In an earlier blog the thermal resistance network shown in Figure 1 was developed. Figure 1: The heat dissipation paths […]
During a feasibility analysis for electronics cooling solutions, the objective is to estimate the heat flow using engineering approaches and […]
Third Frontier Commission Invests in Ohio Businesses Imagine attaching a “booster” to your business, and then imagine the possibilities for […]
We have just completed another successful COMSOL training class, Solving COMSOL Multiphysics Problems. How do we know it was a […]
Many industries face increased thermal challenges with their electronic products. Customers often want devices with smaller form factors and higher […]