COMSOL Multiphysics

Solver Speed-up for Conjugate Heat Transfer with Radiation

COMSOL Multiphysics® can solve conjugate heat transfer problems that include conduction, convection and radiation.  Both Surface-to-Ambiant and Surface-to-Surface radiation formulations are available.  Follow this link June 2019 COMSOL Electronics Cooling Webinar for our recent Webinar that includes a step by step demonstration of implementation in COMSOL Multiphysics®. When using Surface-to-Surface radiation, we strongly recommend that the radiation […]

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Solver Speed-up for Conjugate Heat Transfer with Radiation

COMSOL Multiphysics® can solve conjugate heat transfer problems that include conduction, convection and radiation.  Both Surface-to-Ambiant and Surface-to-Surface radiation formulations are available.  Follow this link June 2019 COMSOL Electronics Cooling Webinar for our recent Webinar that includes a step by step demonstration of implementation in COMSOL Multiphysics®.   When using Surface-to-Surface radiation, we strongly recommend that the

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MRI – Magnetic Resonance Imaging and Simulation

MRI – Magnetic Resonance Imaging and Simulation Magnetic Resonance Imaging (MRI) is one of the most widely used and safest imaging modalities for medical diagnostics. Despite this, one of the major technological challenges facing the biomedical imaging world has been the issues created when a patient with metallic medical implants suffers the need (for any

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COMSOL Workshops

COMSOL Workshops Over the years, our association with COMSOL has grown from one of novice user to avid user to COMSOL Certified Consultant to experts who provide Training Classes to help new and existing users maximize their use of COMSOL Multiphysics. Last fall, we had several conversations with COMSOL about a possible new association. As a result,

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Webinar: Simulation of Thermal-Structure Interaction – July 17th

Simulation of Thermal-Structure Interaction – July 17th   On Thursday, July 17th, Mechanical Engineering and COMSOL will give a free webinar on “Simulation of Thermal-Structure Interaction.” Details and registration are available below.   Live Presentation – Thursday, July 17th, 2014, 2:00pm EDT http://comsol.com/c/17br   Speakers: Kyle C. Koppenhoefer from AltaSim Technologies Shankar Krishnan, Applications Engineer,

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